<table border="1" cellspacing="0" cellpadding="8"><tbody><tr><td>Mounting Type</td><td>Standard</td><td>Type</td><td>Copper heat sink</td></tr><tr><td>Attachment Method</td><td>splice</td><td>Material</td><td>Red copper</td></tr><tr><td>Length</td><td>15mm</td><td>Width</td><td>15mm</td></tr><tr><td>Material type</td><td>Copper material with excellent heat dissipation performance</td><td>Product color</td><td>presenting the natural color of purple copper</td></tr><tr><td>Specification and size</td><td>There are multiple thickness options available</td><td>Surface characteristics</td><td>Smooth surface, no galvanizing, no burrs</td></tr><tr><td>Adhesive configuration</td><td>SYU-T33 thermal conductive adhesive adhesive backing</td><td>Thermal conductivity advantage</td><td>Good thermal conductivity, effectively reducing chip temperature</td></tr><tr><td>Easy to install</td><td>Simply peel off the protective film to stick, easy to operate</td><td>Applicable scenarios</td><td>Suitable for cooling various chips such as mobile phones, tablets, etc</td></tr><tr><td>Durable property</td><td>Stable performance in high temperature environments</td><td>Bonding effect</td><td>seamless bonding with the chip, ensuring heat dissipation efficiency</td></tr></tbody></table>
