<table border="1" cellspacing="0" cellpadding="8"><tbody><tr><td>Type</td><td>consumer electronics pcba</td><td>Copper Thickness</td><td>Customized</td></tr><tr><td>HDI Technology</td><td>Laser drilled blind/buried vias, 0.1 mm hole</td><td>Impedance Tolerance</td><td>±5% (TDR tested,50Ω/1002)</td></tr><tr><td>Surface Roughness Control</td><td>HVLP copper.Ra s 0.5um (for minimal signal loss)</td><td>Layer Count</td><td>6 layers</td></tr><tr><td>Dk /Df</td><td>Dk 3.0-10.2/ Df 0.001-0.020 @10GHz (material dependent)</td><td>Back Drilling Depth Control</td><td>±0.05 mm precision</td></tr><tr><td>Via-in-Pad</td><td>Resin plugging & copper plated over</td><td>ENIG Thickness</td><td>Au 2-4u" / Ni 120-200u"</td></tr><tr><td>Copper Foil Type</td><td>HVLP / RTF/ VLP (for low loss)</td><td>Certifications</td><td>IS09001</td></tr></tbody></table>