<table border="1" cellspacing="0" cellpadding="8"><tbody><tr><td>CAS No.</td><td>7440-50-8</td><td>Application Method</td><td>Laminating etching bonding electronic assembly</td></tr><tr><td>EINECS No.</td><td>231-159-6</td><td>Main Raw Material</td><td>Copper</td></tr><tr><td>MF</td><td>Cu</td><td>Other Names</td><td>Electrolytic Copper Foil</td></tr><tr><td>State</td><td>Roll</td><td>Usage</td><td>PCB shielding battery packs EVs laptops</td></tr><tr><td>Thickness</td><td>0.02 to 0.5 mm</td><td>Width</td><td>5 to 1000 mm</td></tr><tr><td>Purity</td><td>≥99.9%</td><td>Surface</td><td>Smooth</td></tr><tr><td>Tensile Strength</td><td>210 to 250 MPa</td><td>Conductivity</td><td>≥97% IACS</td></tr><tr><td>Flexibility</td><td>High</td><td>Color</td><td>Reddish-brown / Metallic</td></tr></tbody></table>
