<table border="1" cellspacing="0" cellpadding="8"><tbody><tr><td>Application</td><td>ic packaging</td><td>Chemical Composition</td><td>depends</td></tr><tr><td>Material</td><td>Cu</td><td>Shape</td><td>Custom</td></tr><tr><td>Product name</td><td>Copper Cu Sputtering Target</td><td>Material</td><td>CU</td></tr><tr><td>Color</td><td>copper</td><td>Usage</td><td>Electronics, electronic packaging,IC heatsink</td></tr><tr><td>Surface</td><td>polished</td><td>Packing</td><td>Wooden Packing</td></tr><tr><td>MOQ</td><td>1 pc</td><td>OEM/ODM</td><td>Avaliable</td></tr><tr><td>Certificate</td><td>GB/T19001-2008/ISO9001:2008</td><td>Purity</td><td>99.9999%</td></tr></tbody></table>
